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Advanced Materials for Thermal Management of Electronic Packaging Xingcun Colin Tong

By: Material type: TextTextPublication details: New York Springer 2011; New York Springer 2011Description: xxi,616p ill 24cmISBN:
  • 9781441977588
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Item type Current library Call number Copy number Status Date due Barcode
BOOK BOOK MJII RM685.47 Available 0000032287

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