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Integrated Circuit Packaging,Assembly and Interconnections William J.Greig

By: Material type: TextTextPublication details: London,N.Y Springer Heidelberg Dordrecht 2007; London,N.Y Springer Heidelberg Dordrecht 2007Description: xxiv,296p ill 24cmISBN:
  • 9780387281537
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Item type Current library Call number Copy number Status Date due Barcode
BOOK BOOK MJII RM483.85 Available 0000032281

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