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1.
Electronic assembly fabrication Chips, circuit boards, packages, and components Charles A. Harper by
Edition: 1st ed
Material type: Text Text
Publication details: New Yoark McGraw-Hill c2002; New Yoark McGraw-Hill c2002
Availability: Items available for loan: IKM Beseri (1)Call number: TK7870 H373 2002. KKTM Petaling Jaya (2).

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2.
Electronic Packaging and Interconnection handbook Charles A. Harper by
Edition: 4th-ed
Material type: Text Text
Publication details: New York McGraw-Hill Book Company c2005; New York McGraw-Hill Book Company c2005
Availability: Items available for loan: KKTM Petaling Jaya (2).

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