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1.
Fundamentals of microsystems packaging chapter 1-chapter 4 Rao R. Tummala by
Material type: Text Text
Publication details: USA McGraw Hill Professional Publishing c2000; USA McGraw Hill Professional Publishing c2000
Availability: Items available for loan: MJII (6).

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2.
Electronic packaging and interconnection Handbook Charles A. Harper by Series: Electronic packaging and interconnection series
Edition: 4th ed
Material type: Text Text
Publication details: New York The McGraw Hill Companies c2005; New York The McGraw Hill Companies c2005
Availability: Items available for loan: MJII (3).

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